IEEE Conference on Electrical Insulation and Dielectric Phenomena

September 19-22, 2027 – Ottawa, Ontario, Canada

CEIDP 2027 Call-for-Papers [PDF document]

LATEST NEWS:

Venue: Rogers Centre Ottawa

Invitation letters for VISA application need to be requested during author registration.

Companies willing to sponsor the conference can check the Advertisement Standard Offer on the Sponsorship page Here.

About CEIDP:

The CEIDP was established within the Division of Engineering and Industrial Research, National Academy of Sciences – National Research Council in 1920 in Manhattan, NY, and continues to provide opportunity for specialists from around the world to meet and exchange their expertise, annually, now under sponsorship from the IEEE Dielectrics and Electrical Insulation Society. The goal of this annual Conference is to bring together researchers in all disciplines from industry, universities, government, and other laboratories to discuss the latest results and developments in the area of electrical insulation and dielectric phenomena. The conference location is in the Americas. Original contributions are welcomed in theoretical and experimental aspects of dielectric, electronic, and electrostatic research on vacuum and gaseous media and on liquid and solid materials of organic and inorganic origins. The CEIDP is aimed at fostering free discussion of scientific and technical topics but conference participants are expected to avoid any commercialization of their research activities or research results. Membership in IEEE, DEIS, or other organizations is not required to participate in the Conference. However, it is strongly encouraged that CEIDP Board and Executive Committee are chosen from among the DEIS members.

IMPORTANT DATES:

Deadline for abstract submission: December 01,2026
Notification of abstract acceptance: January 15, 2027
Deadline for full-paper submission: March 01,2027
Notification of full-paper acceptance: April 15, 2027

Conference Registration Cut-Off Dates:
Early Bird Registration Fee Deadline: August 01, 2027
Late Online Registration Fee Deadline: September 01, 2027

GENERAL Information:

CEIDP 2027 Call-for-Papers [PDF document]

New CEIDP Board Member Applications for 2027-2029 will open soon. See the Conference Committee page.

Submit a contribution:

>> SUBMIT AN ABSTRACT << (Not Open yet)

CEIDP Abstract Template [Word Document]

Abstracts are limited to 1 page. Deadline: December 01, 2026

CEIDP Final Paper Template [Word Document]

Full-paper (only once abstract is accepted) are limited to 4 pages (additional fees per extra-page, see Registration page). Deadline: March 01, 2027

Registration of one author is required. Registration is free and does not require conference fee payment for abstract submission.

Accommodation:

IEEE CEIDP 2027 will be hosted at the Rogers Centre Ottawa, Ottawa, Ontario, Canada

A proposed hotel list will be provided on the Venue/Travel page soon.