IEEE Conference on Electrical Insulation and Dielectric Phenomena

October 06-09, 2024 – Auburn, AL, USA

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>> SUBMIT THE FULL-PAPER << (now open, Extended to June 22, 2024.)

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Welcome to the 99th IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE CEIDP 2024) which will be held in Auburn, AL, USA from October 06-09, 2024.

IEEE CEIDP 2024 will be hosted at The Hotel at Auburn University and Dixon Conference Center, 241 S College St, Auburn, AL 36830, United States.

About CEIDP:

The CEIDP was established within the Division of Engineering and Industrial Research, National Academy of Sciences – National Research Council in 1920 in nearby Manhattan, NY, and continues to provide opportunity for specialists from around the world to meet and exchange their expertise, annually, now under sponsorship from the IEEE Dielectrics and Electrical Insulation Society. The goal of this annual Conference is to bring together researchers in all disciplines from industry, universities, government, and other laboratories to discuss the latest results and developments in the area of electrical insulation and dielectric phenomena. The conference location is in the Americas. Original contributions are welcomed in theoretical and experimental aspects of dielectric, electronic, and electrostatic research on vacuum and gaseous media and on liquid and solid materials of organic and inorganic origins. The CEIDP is aimed at fostering free discussion of scientific and technical topics but conference participants are expected to avoid any commercialization of their research activities or research results. Membership in IEEE, DEIS, or other organizations is not required to participate in the Conference. However, it is strongly encouraged that CEIDP Board and Executive Committee are chosen from among the DEIS members.

IMPORTANT DATES:

Deadline for abstract submission: March 29, 2024. Extended to April 14, 2024.
Notification of abstract acceptance: April 26, 2024
Deadline for full-paper submission: June 15, 2024. Extended to June 22, 2024.
Notification of full-paper acceptance: July 15, 2024

Conference Registration Cut-Off Dates:
Early Bird Registration Fee Deadline: September 07, 2024
Late Online Registration Fee Deadline: September 29, 2024
Conference hotel reservation cut-off date: Will be available soon

GENERAL Information:

New CEIDP Board Member Applications for 2024-2026 are now open. See the Conference Committee page.


Submit a contribution:

>> SUBMIT AN ABSTRACT << (Now open)

CEIDP Abstract Template [Word Document]

Abstracts are limited to 1 page. Deadline: March 29, 2024. Extended to April 14, 2024.

CEIDP Final Paper Template [Word Document]

Full-paper (only once abstract is accepted) are limited to 4 pages (additional fees per extra-page, see Registration page). Deadline: June 15, 2024. Extended to June 22, 2024.

Registration of one author is required. Registration is free and does not require conference fee payment for abstract submission.

Accommodation:

IEEE CEIDP 2024 will be hosted at The Hotel at Auburn University and Dixon Conference Center, 241 S College St, Auburn, AL 36830, United States.

All the details to reach the hotel can be found on the Venue/Travel page.

Conference room rate: Will be available soon.

Book your room at The Hotel at Auburn University and Dixon Conference Center: Available soon.

Hotel reservation cut-off date: Will be available soon

Website updated by Dr. Sombel Diaham and Dr. Jérôme Castellon, CEIDP Publication & Publicity Chairs

Contact us: Here

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