IEEE Conference on Electrical Insulation and Dielectric Phenomena
October 06-09, 2024 – Auburn, AL, USA
CEIDP 2024 Call-for-Papers [PDF document]
| LATEST NEWS: >> SUBMIT AN ABSTRACT << (Available soon) Companies willing to sponsor the conference can check the Advertisement Standard Offer on the Sponsorship page Here. |
Welcome to the 99th IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE CEIDP 2024) which will be held in Auburn, AL, USA from October 06-09, 2024.
IEEE CEIDP 2024 will be hosted at The Hotel at Auburn University and Dixon Conference Center, 241 S College St, Auburn, AL 36830, United States.
About CEIDP:
The CEIDP was established within the Division of Engineering and Industrial Research, National Academy of Sciences – National Research Council in 1920 in nearby Manhattan, NY, and continues to provide opportunity for specialists from around the world to meet and exchange their expertise, annually, now under sponsorship from the IEEE Dielectrics and Electrical Insulation Society. The goal of this annual Conference is to bring together researchers in all disciplines from industry, universities, government, and other laboratories to discuss the latest results and developments in the area of electrical insulation and dielectric phenomena. The conference location is in the Americas. Original contributions are welcomed in theoretical and experimental aspects of dielectric, electronic, and electrostatic research on vacuum and gaseous media and on liquid and solid materials of organic and inorganic origins. The CEIDP is aimed at fostering free discussion of scientific and technical topics but conference participants are expected to avoid any commercialization of their research activities or research results. Membership in IEEE, DEIS, or other organizations is not required to participate in the Conference. However, it is strongly encouraged that CEIDP Board and Executive Committee are chosen from among the DEIS members.
IMPORTANT DATES:
Deadline for abstract submission: March 29, 2024
Notification of abstract acceptance: April 26, 2024
Deadline for full-paper submission: June 01, 2024
Notification of full-paper acceptance: July 15, 2024
Conference Registration Cut-Off Dates:
Early Bird Registration Fee Deadline: September 07, 2024
Late Online Registration Fee Deadline: September 29, 2024
Conference hotel reservation cut-off date: Will be available soon
GENERAL Information:
CEIDP 2024 Call-for-Papers [PDF document]
New CEIDP Board Member Applications for 2024-2026 are now open. See the Conference Committee page.
Submit a contribution:
>> SUBMIT AN ABSTRACT << (Available soon)
CEIDP Abstract Template [Word Document]
Abstracts are limited to 1 page. Deadline: March 29, 2024
CEIDP Final Paper Template [Word Document]
Full-paper (only once abstract is accepted) are limited to 4 pages (additional fees per extra-page, see Registration page). Deadline: June 01, 2024
Registration of one author is required. Registration is free and does not require conference fee payment for abstract submission.
Accommodation:
IEEE CEIDP 2024 will be hosted at The Hotel at Auburn University and Dixon Conference Center, 241 S College St, Auburn, AL 36830, United States.
All the details to reach the hotel can be found on the Venue/Travel page.
Conference room rate: Will be available soon.
Book your room at The Hotel at Auburn University and Dixon Conference Center: Available soon.
Hotel reservation cut-off date: Will be available soon
Website updated by Dr. Sombel Diaham and Dr. Jérôme Castellon, CEIDP Publication & Publicity Chairs
Contact us: Here
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