IEEE Conference on Electrical Insulation and Dielectric Phenomena

Dates: October 30-November 02, 2022

Place: Denver, CO, USA

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LATEST NEWS: (will be updated regularly)

>> SUBMIT YOUR ABSTRACT HERE <<

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Welcome to the 97th IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE CEIDP 2022) which will be held in Denver, CO, USA from October 30-November 02, 2022.

IEEE CEIDP 2022 will be hosted at the Hilton Garden Inn Denver Union Station Hotel, 1999 Chestnut Pl, Denver, CO 80202, United States.

About CEIDP:

The CEIDP was established within the Division of Engineering and Industrial Research, National Academy of Sciences – National Research Council in 1920 in nearby Manhattan, NY, and continues to provide opportunity for specialists from around the world to meet and exchange their expertise, annually, now under sponsorship from the IEEE Dielectrics and Electrical Insulation Society. The goal of this annual Conference is to bring together researchers in all disciplines from industry, universities, government, and other laboratories to discuss the latest results and developments in the area of electrical insulation and dielectric phenomena. The conference location is in the Americas. Original contributions are welcomed in theoretical and experimental aspects of dielectric, electronic, and electrostatic research on vacuum and gaseous media and on liquid and solid materials of organic and inorganic origins. The CEIDP is aimed at fostering free discussion of scientific and technical topics but conference participants are expected to avoid any commercialization of their research activities or research results. Membership in IEEE, DEIS, or other organizations is not required to participate in the Conference. However, it is strongly encouraged that CEIDP Board and Executive Committee are chosen from among the DEIS members.

IMPORTANT DATES:

Deadline for abstract submission: March 01, 2022 -> Extended until March 29, 2022.
Notification of abstract acceptance: May 01, 2022
Deadline for full-paper submission: July 01, 2022
Notification of full-paper acceptance: August 01, 2022

Conference Registration Cut-Off Dates: Coming soon
Early Bird Registration Fee Deadline: Coming soon
Late Online Registration Fee Deadline: Coming soon
Conference hotel reservation cut-off date: Coming soon

Remote participation:

NOTE: Please note that due to COVID-19, we may face uncertainty related to travel options and restrictions as well as economic impacts. While we are planning for an in-person meeting, it might be decided in due course and only if necessary to work on the possibility to offer remote presentations for conference attendees who experience travel restrictions.

More information will be announced along 2022 ...

COVID-19 SITUATION IN Denver, CO, USA:

More information will be announced along 2022 ... 

Denver (CO) Travel Requirements: COVID-19 Official Information

Latest Information:

>> SUBMIT YOUR ABSTRACT HERE <<

New CEIDP Board Member Applications for 2023-2025 are now open. See the Conference Committee page.


Submit a contribution:

>> SUBMIT YOUR ABSTRACT HERE <<

CEIDP Abstract Template [Word Document]

Abstracts are limited to 1 page. Deadline: March 01, 2022 -> Extended toMarch 29, 2022

CEIDP Final Paper Template [Word Document]

Full-paper (only once abstract is accepted) are limited to 4 pages (additional fees per extra-page). Deadline: July 01, 2022

Registration of one author is required. Registration is free and does not require conference fee payment for abstract submission.

Accommodation:

IEEE CEIDP 2022 will be hosted at the Hilton Garden Inn Denver Union station Hotel, 1999 Chestnut Pl, Denver, CO 80202, USA.

All the details to reach the hotel can be found on the Venue/Travel page.

Conference room rate: $159 for single/double

Book your room at the Hilton Garden Inn Denver Downtown (will be announced later)

Past CEIDP editions:

2018 Conference Attendees in Cancun, Mexico
2019 Conference Attendees in Richland, Washington, USA

Website updated by Dr. Sombel Diaham and Dr. Jérôme Castellon, CEIDP Publication & Publicity Chairs

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